Rengo to Exhibit at TOKYO PACK 2026 (Tokyo International Packaging Exhibition 2026)
Rengo Co., Ltd. announces that it will exhibit at TOKYO PACK 2026 (Tokyo International Packaging Exhibition 2026).
Rengo's booth, themed around "New Value for Packaging," will present the Rengo Group's efforts to advance its environmental initiatives, along with a wide range of products and solutions that can inspire new value creation in sales promotion and distribution.
As "General Packaging Industry (GPI) Rengo," we create high value-added products from fewer resources, based on the key concept of "Less is more." Rengo hopes that visitors will take the opportunity to visit the company's booth and see its latest solutions.
Overview of TOKYO PACK 2026
| Date | 10 a.m.–5 p.m., October 14-16, 2026 |
|---|---|
| Location | East Halls 1-3, 7 & 8, Tokyo Big Sight (Tokyo International Exhibition Center) |
| Theme | Innovative Packaging Technology: The link between our future planet and generations |
| Organizer | Japan Packaging Institute (JPI) |
| Entrance fee | Free (Registration required) |
Rengo-related Exhibits
• Rengo's booth: 1R18, East Hall 1
•Exhibition of 12 award-winning products from the Japan Packaging Contest and
one Kinoshita Prize-winning product: Good Packaging Pavilion 2026 and Kinoshita Prize Exhibition,
rear right of East Hall 7.