Rengo Co., Ltd. announces that it will exhibit at the Tokyo International Packaging Exhibition 2021 (TOKYO PACK 2021) to be held at Tokyo Big Sight starting from February 24.
Rengo's booth, with the concept of “NEXT! For the Next Generation—Changing Corrugated Packaging, Changing Living,” will introduce DEGI-PAKE, which maximizes the appeal of products through the high-definition reproducibility of digital pre-printing and variable printing, Rengo Smart Display Packaging (RSDP), which significantly improves the ease with which retailers can unpack and display their products, and New Smart Display Packaging (NSD), which is aimed at the next generation. Additionally, visitors can see a wide range of products and technologies developed by Rengo, including biodegradable materials, products with virus resistant properties, and e-commerce packaging systems.
As “General Packaging Industry (GPI) Rengo,” we create high value-added products from fewer resources, based on the concept of “Less is more.”
We hope that visitors will take the opportunity to visit the Rengo booth and see the company's cutting-edge solutions.