Rengo Co., Ltd. (Head Office: Kita-ku, Osaka; Chairman, President & CEO: Kiyoshi Otsubo) announces that it will exhibit at the Tokyo International Packaging Exhibition 2016 (Tokyo Pack 2016) to be held at Tokyo Big Sight starting October 4.

Rengo's booth will be based on the concept of “Maximizing Customer Value through Packaging,” and will introduce new packaging systems and styles that contribute toward resolving labor shortage issues and increasing delivery efficiency, and drastically improve packaging and delivery processes in logistics businesses. These include the “Retail Mate Series,” which contributes toward lowering the cost of operations by lightening workloads, increasing efficiency of packaging work in logistics warehouses and storerooms, improving shop stocking and display performance, and greatly increasing sales promotion.

Visitors can view many cutting-edge packaging solutions from Rengo, a General Packaging Industry (GPI) that creates high-added value products that use fewer resources based on the concept of “Less is more.”

We hope that visitors will take the opportunity to attend the Rengo booth.