Rengo Co., Ltd. (Head Office: Kita-ku, Osaka; Chairman, President & CEO: Kiyoshi Otsubo) announces that it will exhibit at the Tokyo International Packaging Exhibition 2018 (Tokyo Pack 2018) to be held at Tokyo Big Sight starting October 2.

Rengo's booth will be based on the concept of “Cross Innovation: into the future,” and will introduce a variety of packaging innovations that are one step ahead, which have been generated by combining Rengo's unique technologies and ideas.

Rengo will exhibit a wide variety of packaging solutions that seek to resolve urgent societal issues such as labor shortages and delivery problems. These solutions include the Retail Mate series, which significantly improves the ease with which retailers can unpack and display their products, and the Gemini Packaging System, which automates the packaging process at distribution centers. In addition, the booth will display unprecedented new usage examples for digital printing in the packaging industry.

Rengo is a General Packaging Industry (GPI) that creates high added-value products from fewer resources, based on the concept of “Less is more.” We hope that visitors will take the opportunity to attend the Rengo booth and see the company's cutting-edge solutions.