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  • December 24, 2014

    Rengo Wins World Packaging Organisation's WorldStar Award for its Corrugated Packaging (Octagonal Cushioning Material) for Fans

    Rengo Co., Ltd. (Head Office: Kita-ku, Osaka; Chairman, President & CEO: Kiyoshi Otsubo) announces that it has won the WorldStar Award in the 2015 WorldStar Contest hosted by the World Packaging Organisation (WPO) for its “corrugated packaging (octagonal cushioning material) for fans,” which was jointly developed with Daikin Industries, Ltd.

    This corrugated packaging was designed with standardized specifications that can accommodate 73 parts having different diameters and heights. The octagonal cushioning material and folded flaps inside the box reliably secure parts of various sizes, protecting them from external shocks. The octagonal cushioning material is assembled simply by being pushed into the box, significantly improving packaging work efficiency.

    Through its tireless efforts to develop innovative packaging solutions that fulfill the fundamental functions of product packaging and decoration while also being friendly both to people and the environment, Rengo strives to fully respond to the present and future needs of its customers.

     

    Corrugated packaging (octagonal cushioning material) for fans, the award-winning item

    Conventional type


    Conventional type

    Proposed type


    Proposed type

     

    Proposed typeThe WorldStar Contest
    The WorldStar Contest is an international packaging contest hosted by the World Packaging Organisation (WPO). The objective of this contest is to judge packaging in terms of factors including ease of use, design, and environmental friendliness, and to raise awareness of and promote packaging technology of excellent quality. In this year's contest, there were 265 entries from 37 countries, of which 148 received awards.
    Note that this Rengo packaging design also received the Package Technology Award (Appropriate Packaging Award) at the 2014 Japan Packaging Contest hosted by the Japan Packaging Institute.